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GEMINI HQ PECVD

PECVD (GEMINI HQ PECVD 系统设备) 应用于淀积二氧化硅(TEOS)薄膜,氮氧化硅(SiON)薄膜,非晶硅(A-Si)薄膜等多种薄膜 - 采用等离子体增强化学气相沉积技术生产介电薄膜,如抗反射涂层和硬掩膜介质 - 提供优异的原子层沉积薄膜均匀性能 此外,所产生 a-Si薄膜广泛应用于DPT / QPT硬掩膜模图案化解决方案,适用于20nm以上的先进DRAM和逻辑器件 优异的薄膜均匀性,高吞吐量,产能高,良好的颗粒控制技术和工艺可靠性

Process

- SiON

- a-Si

- TEOS


Applications

- Anti Reflective Coating

- Hardmask Dielectric


Introduction.

GEMINI CVD system produces dielectric films with plasma-enhanced chemical vapor deposition technology such as Anti-Reflective Coating and hardmask.

Our PECVD system provides excellent ALD-like superior uniformity performance. In addition, GEMINI a-Si films are widely used in DPT/QPT hard-mask patterning solution for advanced DRAM and Logic devices beyond 20nm.


Technology.

As device scales down, uniformity is important as it can affect wafer CD variation which leads to poor device fabrication. Since dielectric films are used to form insulating features in a semiconductor device, it requires films that are exceptionally smooth as it will affect subsequent layers. GEMINI PECVD dielectric films are well-known for its extremely outstanding uniformity. Not only it has a superior productivity, but also it significantly reduces cost of ownership with very high- throughput.


Features.

- High Throughput

- Extreme Thickness Uniformity (TEOS/SiON -<0.5%)

- Excellent Tool Matching

 → User Friendly New S/W, Distribution Control System, Ether-CAT

- Process Reliability

 → TCS, Precision Moving Assembly

- Wide TEOS Process Window(Thin to Ultra High Thickness with ESC for Backside Deposition free)